Kamis, 13 November 2014


XSCAN-3080 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach. Experience a life of efficiency make product by equipment suitable for advance a method of construction.


PCB / BGA inspection
    • Focus Size : 33μm, 80kv
    • Max PCB Size : 350 x 300mm
    Geometric magnification
      • Geometric Enlargement ratio : 20x
      • Enlargement on monitor : 300x
      • Automatic position teaching and replying
      • Mediocrity
      • Easy inspection by manal manipulator
      Pseudo 3D image display
        Simple maintenance
          • Sealed type's x-ray tube
          High Resolution (option)
          • Noise clearing capacity
          • Pseudo Coloring, 3D Image
          Easy to use
          • Easy to use by mouse
          Inspection for BGA, PCB, MLB
          • Easy input and inspect BGA input Bed
          • void, short, excessive solder, insufficient solder inspect capacity
          User-friendly and easy to use


          X-ray Tube
          Focus Size33μm
          Tube Current/Voltage/PowerMax. 250μA/ 80kV/ 15W
          Geometric Enlargement Ratio3x to 20x
          Enlargement Ratio on the Monitor10x to 3000x
          Aging (Preheating)Automatic
          X-ray shield box and others
          Dimension and Weight540mm x 550mm x 1000mm (WxDxH), 150kg
          Externally leaking dose1uSv/h or less
          Power Supply220VAC±10% 50/60Hz

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