Kamis, 13 November 2014

XSCAN-6000

  • Inspection for BGA, CSP, flip-chip, etc
  • Inspection for bare PCB, etc
  • Inspection for die casting
  • Inspection for multi-layered board




  • Feature

    • Geometric magnification : Max. 100x
    • Focus size : Min. 5μm, 130/90/80kV
    • Max. PCB Size : 500 x 400 mm
    • Max. PCB Size : 500 x 400 mm
    • Automatic brightness & contrast adjustment in Live
    • Pseudo 3-dimensional images
    • Position teaching and replay

    Spesification


    CT Images
     
    BGA Sample Images


    Fluoroscopic Images on PCB's


    Fluoroscopic Images

    Software

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