XSCAN-7000 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach. Experience a life of efficiency make product by equipment suitable for advance a method of construction.
Feature
- Stack via
- NMBI (Neo Manattan Bump Interconnection)
- PCB for Flip-Chip
- PCB for BGA
- High Resolution Alignment (2?)
- Simulation for Re-Inspection
- Statistical Product Management
- Auto Calibration
- Closed-Type Tube
- Measurement / Analysis Software
Spesification
| Mark Images |
    |
 | Binary Images for Mark-Inspection |
   |
| Welding Images |
  |
| Sofrware for PCB Allgnment |
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