XSCAN-3080

XSCAN-3080 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach. Experience a life of efficiency make product by equipment suitable for advance a method of construction.

Feature

PCB / BGA inspection

• Focus Size : 33μm, 80kv
• Max PCB Size : 350 x 300mm

Geometric magnification

• Geometric Enlargement ratio : 20x
• Enlargement on monitor : 300x
• Automatic position teaching and replying
• Mediocrity
• Easy inspection by manal manipulator

Pseudo 3D image display

Simple maintenance

• Sealed type's x-ray tube

High Resolution (option)

• Noise clearing capacity
• Pseudo Coloring, 3D Image

Easy to use

• Easy to use by mouse

Inspection for BGA, PCB, MLB

• Easy input and inspect BGA input Bed

• void, short, excessive solder, insufficient solder inspect capacity

User-friendly and easy to use

Spesification

X-ray Tube
Focus Size	33μm
Tube Current/Voltage/Power	Max. 250μA/ 80kV/ 15W
Geometric Enlargement Ratio	3x to 20x
Enlargement Ratio on the Monitor	10x to 3000x
Aging (Preheating)	Automatic
X-ray shield box and others
Dimension and Weight	540mm x 550mm x 1000mm (WxDxH), 150kg
Externally leaking dose	1uSv/h or less
Power Supply	220VAC±10% 50/60Hz